A12725
Circuit Technology Circuit Frame, BGA Pads 2.25" x 1.50" (57 x 38 mm). saldatura - accessori, frame, rivetti, piste, riparazione circuiti.
Circuit Technology Circuit Frame, BGA Pads 025"/035"
Circuit Frame with dry-film adhesive backing that makes replacing damaged circuits easy, fast and highly reliable.
Specifications:
| Overall Frame Size |
2.25" x 1.50" (57 x 38 mm) |
| Description |
BGA Pads .025"/.035" (.635 mm/.889 mm) Diameter |
| Plating |
Bright Tin |
| Base Material |
Rolled annealed copper foil .0014" (.036 mm) thick. |
| Adhesive Backing |
B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
| Certification |
Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
| Solder Resistance |
Passes IPC Spec 10 sec at 288°C (550°F). |
| Bonding Temperature |
475°F ± 25°F (246°C ± 14°C) |
| Bonding Pressure |
200 - 400 psi (14-28 kg/cm2) |
| Bonding Time |
30 seconds |
| Peel Strength |
Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
| Shelf Life |
1 year minimum. Each Circuit Frame package is stamped with the expiration date. |
| Plating |
.0001" (.0025 mm) Bright Tin (Lead Free) |
| Outgassing |
The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
| Compliance |
RoHS Compliant IPC4562A and IPC4562/7 |
UM. PZ
Disponibilità bassa
Generalmente disp. in 30 gg.
A12725
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