Circuit Technology Wire Dots (10.0 mm) Round 210/Pkg

A12736

Circuit Technology - Wire Dots Round consisting of a thin, flexible polymer film 1.0 mil (.025 mm) coated on one. 210/Pkg. Riparazione circuiti.

UM. CF
Disponibilità bassa
Disponibilità bassa
Generalmente disp. in 20 gg.
Qt.Min.Ord. 2

Contattaci:

78,00
IVA esclusa

ALLEGATI

SCHEDA TECNICA

Circuit Technology Wire Dots (10.0 mm) Round 210/Pkg

Clean up your act when bonding wires. Wire Dots make the job of bonding jumper wires neat and fast.

Wire Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. The result is a highly conformable, high strength bond.

Wire Dots will hold secure after exposure to numerous chemicals including cleaning solutions/sprays, saponifiers, mild acids and alkalies.

Wire Dots will hold secure through a typical circuit board hot water wash.

 

Material Properties:

Cover Film Clear Polyester Film 1.0 mil (.025 mm) Thick
Adhesive High performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP)
Relative High Temperature Operating Ranges Short term (minutes/hours) 400°F (204°C)
Long term (days/weeks) 300°F (149°C)
Application Specifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic markets.
Shelf Life Minimum 12 months.

 

Physical and Thermal Properties:

Property Typical Value Unit Test Method
Peel Strength 72 hrs @ 22 C 84 0z./in. ASTM D3330 Modified
Static Shear Strength 72 F (22 C) / 1000g >10,000 min ASTM D3654
Tensile Strength (Yield) 72 F (22 C) >2600 psi ASTM D2370
Elongation 100 % ASTM D2370
Thermal Conductivity 0.17 w/m-k ASTM C518
Coefficient of Thermal Expansion 5.5 x 10 -4 m/m/C ASTM D696 25-175C

 

Electrical Properties:

Property Typical Value Unit Test Method
Dielectric Strength 1700 volts/mil ASTM D149
Dielectric Constant 25 C, 1 kHz 3.4 ------ ASTM D150
Dissipation Factor 25 C, 1 kHz 0.018 ------ ASTM D150
Surface Resistivity - Adhesive Layer >1 x 10 14 ohm/square ASTM D257
Surface Resistivity - Polymer Film Layer >1 x 10 16 ohm/square ASTM D257
Volume Resistivity - Adhesive Layer >1 x 10 15 ohm/cm ASTM D257
Volume Resistivity - Polymer Film Layer >1 x 10 18 ohm/cm ASTM D257
Insulation/Moisture Resistance - Adhesive Layer >1 x 10 11 ohm MIL-I-46058C (100 VDC 60 sec)
Insulation/Moisture Resistance - Polymer Film Layer >1 x 10 12 ohm MIL-I-46058C (100 VDC 60 sec)
Voltage Breakdown 3500 volts ------

 

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