A12761
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded PC boards - All in about 30 seconds. Replacement circuit frames with dry-film epoxy backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to PC board surface frame or let us design and fabricate a custom size. Specifications: Overall sizes: 2.25" x 1.50"; Base material: rolled annealed copper foil, .0014: thick; Adhesive backing: thermostat phenolic butral film, .0018" thick; Bonding temp: 475 degrees F +/-25 degrees F; Bonding time: 30 seconds; Peeling strength: minimum 8 lbs, /inch after cure to FR-4 laminate. Plating options: (T) tin lead: .001" 60/40 tin/lead min.; (G) nickel/gold: .000050" gold over .000100" nickel min.; (U) unplated: No plating. Standard plating is noted on the lower corner of each circuit frame.
UM. PZ
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CC090300AG
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