Circuit Technology Circuit Frame, BGA Pads 025"/035"

A12725

Circuit Technology Circuit Frame, BGA Pads 2.25" x 1.50" (57 x 38 mm). saldatura - accessori, frame, rivetti, piste, riparazione circuiti.

UM. PZ
Disponibilità bassa
Disponibilità bassa
Generalmente disp. in 20 gg.

Contattaci:

94,00
IVA esclusa

SCHEDA TECNICA

Circuit Technology Circuit Frame, BGA Pads 025"/035"

Circuit Frame with dry-film adhesive backing that makes replacing damaged circuits easy, fast and highly reliable.

 

Specifications:

Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Description BGA Pads .025"/.035" (.635 mm/.889 mm) Diameter
Plating Bright Tin
Base Material Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance Passes IPC Spec 10 sec at 288°C (550°F).
Bonding Temperature 475°F ± 25°F (246°C ± 14°C)
Bonding Pressure 200 - 400 psi (14-28 kg/cm2)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life 1 year minimum. Each Circuit Frame package is stamped with the expiration date.
Plating .0001" (.0025 mm) Bright Tin (Lead Free)
Outgassing The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Compliance RoHS Compliant IPC4562A and IPC4562/7

 

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