Reliable Circuitry Repair Using Adhesive Backed Circuit Frames
Imagine replacing damaged circuits without the mess of liquid epoxy, with a bond strength equal to the original, on bare or loaded PC boards - all in about 30 seconds. Replacement Circuit Frames with dry-film epoxy backing make this delicate, precise procedure quick and neat. Trim out the circuit you need and bond it to PC board surface with a bonding iron or bonding press. Choose a standard circuit frame or let us design and fabricate a custom size.
Material Specificiations: Overall Size: 2.25" x 1.50"; Base Material; Rolled annealed copper foil .0014" thick; Adhesive Backing Thermoset Phenolic Butral film .0018" thick; Bonding Temp: 500°F +/- 25°F; Bonding Time: 30 Seconds; Peeling Strength: Minimum 8 lbs/inch after cure to FR-4 laminate. Plating Options: Tin: Bright tin .0005" minimum; Nickel/Gold: .000050" gold over .000100" nickel minimum.
Using dry film adhesive backed circuit frames to repair damaged surface mount pads, BGA pads, gold edge contacts and conductors complies with the IPC suggested guidelines for reliability.
Circuit Frame, Lands .050"/.060"
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