Tutti i prezzi pubblicati sono in Euro ed IVA esclusa.
Tutti i prezzi pubblicati sono in Euro ed IVA esclusa
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Manuale in inglese IPC-6018D - Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Manuale in inglese IPC-6018DS: Space and Military Avionics Applications Addendum to IPC-6018D Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.

Manuale in inglese IPC-7711/7721D Rework, Modification and Repair of Electronic Assemblies

Manuale in inglese IPC-9111 - Troubleshooting for Printed Board Assembly Processes

Manuale in inglese IPC/WHMA-A-620E-EN Requirements and Acceptance for Cable and Wire Harness Assemblies

Manuale in inglese IPC-A-600 Revisione K Acceptability of Printed Boards

Manuale in inglese IPC-A-600 Revisione M Acceptability of Printed Boards

Manuale IPC-A-610J-EN Acceptability of Electronic Assemblies

Manuale IPC-J-STD-003 - Revision D- Solderability Tests for Printed Boards - Versione inglese

Manuale IPC-J-STD-001 - Revision J - Addendum - Space and Military: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies

MANUALE J-STD-001J REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES VERSIONE INGLESE

Manuale J-STD-033D in Inglese - Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices

Topline Mixed Technology 2 Kit - 2-Layer FR4 Board SnPb-HASL PCB SnPb Components BGA169 SnPb Without Daisy Chain Packaging: 100 Kits Packed for Machine Assembly

Topline Mixed Technology 2 Kit - 2-Layer FR4 Board SnPb-HASL PCB SnPb Components BGA169 SnPb Without Daisy Chain Packaging: 50 Kits Packed for Machine Assembly

Topline Mixed Technology 2 Kit - 8 Layer Polyimide Board SnPb HASL Finish SnPb Components BGA169 SnPb Without Daisy Chain Tg=260C (DSC) Tg=250C (TMA) Design Considerations: Use maximum possible copper on all layers. Minimum 2 layers to represen

Topline Mixed Technology 2 Kit - 8 Layer Polyimide Board SnPb HASL Finish SnPb Components BGA169 SnPb Without Daisy Chain Tg=260C (DSC) Tg=250C (TMA) Design Considerations: Use maximum possible copper on all layers. Minimum 2 layers to represen

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