Circuit Technology Circuit Bond Epoxy, 2 gram packages


Circuit Technology Clear Epoxy, 2 gram pre-measured packages. CEPEITALIA, saldatura - accessori, adesivi, riparazione circuiti.

Disponibilità bassa
Disponibilità bassa
Generalmente disp. in 20 gg.
Qt.Min.Ord. 2


IVA esclusa


Clear Circuit Bond Epoxy

Clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.



Packaging 2 gram pre-measured packages
Mix ratio 4 parts resin to 1 part hardener
Mix Ratio by Weight (R/H) 100/25
Color Clear, transparent
Pot life 30 minutes
Cure cycle 24 hours at room temperature (25 °C) or 4 hours @ 65°C
Thixotropic Index 1
Specific Gravity 1.20
Percent Solids 100%
Viscosity (after mixing) 2000 cps
Operating temperature range -55°C to 135°C
Hardness 88 Shore D
Lap Shear, Alum to Alum 1100 psi
Glass Transition Temperature, Ultimate 92°C
Coefficient of Expansion, cm/cm/°C 6 E-05
Dielectric strength 400 volts/mil
Dielectric Constant, 1KHz@25°C 4
Shelf Life 6 months minimum


Application Instructions:

1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles.
5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors.
6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required.
7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).