Clear Circuit Bond Epoxy
Clear, low viscosity, superior strength epoxy, precisely measured out into two-compartment plastic packages so it's easy to use and there's no measuring.
Specifications:
| Packaging |
2 gram pre-measured packages |
| Mix ratio |
4 parts resin to 1 part hardener |
| Mix Ratio by Weight (R/H) |
100/25 |
| Color |
Clear, transparent |
| Pot life |
30 minutes |
| Cure cycle |
24 hours at room temperature (25 °C) or 4 hours @ 65°C |
| Thixotropic Index |
1 |
| Specific Gravity |
1.20 |
| Percent Solids |
100% |
| Viscosity (after mixing) |
2000 cps |
| Operating temperature range |
-55°C to 135°C |
| Hardness |
88 Shore D |
| Lap Shear, Alum to Alum |
1100 psi |
| Glass Transition Temperature, Ultimate |
92°C |
| Coefficient of Expansion, cm/cm/°C |
6 E-05 |
| Dielectric strength |
400 volts/mil |
| Dielectric Constant, 1KHz@25°C |
4 |
| Shelf Life |
6 months minimum |
Application Instructions:
| 1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use. |
| 2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents. |
| 3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed. |
| 4. NOTE: Circuit Bond may contain bubbles from the mixing process. If needed use a vacuum system to remove bubbles. |
| 5. If desired Color Agent can be mixed in with Circuit Bond to match surface colors. |
| 6. Apply using a Foam Swab, Micro Probe or Mixing Stick as required. |
| 7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F). |
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