Tutti i prezzi pubblicati sono in Euro ed IVA esclusa.
Tutti i prezzi pubblicati sono in Euro ed IVA esclusa
Circuit Technology Circuit Frame, Lands 090"/100". saldatura - accessori, frame, rivetti, piste, riparazione circuiti.
Circuit Frame with dry-film adhesive backing that makes replacing damaged circuits easy, fast and highly reliable.
Specifications:
Overall Frame Size | 2.25" x 1.50" (57 x 38 mm) |
Description | Lands .090"/.100" (2.286 mm/2.540 mm) Diameter |
Plating | Bright Tin |
Base Material | Rolled annealed copper foil .0014" (.036 mm) thick. |
Adhesive Backing | B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
Certification | Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
Solder Resistance | Passes IPC Spec 10 sec at 288°C (550°F). |
Bonding Temperature | 475°F ± 25°F (246°C ± 14°C) |
Bonding Pressure | 200 - 400 psi (14-28 kg/cm2) |
Bonding Time | 30 seconds |
Peel Strength | Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
Shelf Life | 1 year minimum. Each Circuit Frame package is stamped with the expiration date. |
Plating | .0001" (.0025 mm) Bright Tin (Lead Free) |
Outgassing | The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
Compliance | RoHS Compliant IPC4562A and IPC4562/7 |
Contattaci:
Circuit Frame with dry-film adhesive backing that makes replacing damaged circuits easy, fast and highly reliable.
Specifications:
Overall Frame Size | 2.25" x 1.50" (57 x 38 mm) |
Description | Lands .090"/.100" (2.286 mm/2.540 mm) Diameter |
Plating | Bright Tin |
Base Material | Rolled annealed copper foil .0014" (.036 mm) thick. |
Adhesive Backing | B-staged modified acrylic film adhesive .002" (.051 mm) thick. |
Certification | Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films. |
Solder Resistance | Passes IPC Spec 10 sec at 288°C (550°F). |
Bonding Temperature | 475°F ± 25°F (246°C ± 14°C) |
Bonding Pressure | 200 - 400 psi (14-28 kg/cm2) |
Bonding Time | 30 seconds |
Peel Strength | Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material. |
Shelf Life | 1 year minimum. Each Circuit Frame package is stamped with the expiration date. |
Plating | .0001" (.0025 mm) Bright Tin (Lead Free) |
Outgassing | The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06% |
Compliance | RoHS Compliant IPC4562A and IPC4562/7 |