Circuit Technology Wire Dots Squares 10.0mm 210/pk , Cepeitalia

SALDATURA - MATERIALI > Frame - rivetti - piste

A12728

Circuit Technology - Wire Dots Squares consisting of a thin, flexible polymer film 1.0 mil (.025 mm) coated on one. 210/Pkg. Riparazione circuiti.

Linea CIRCUIT TECHNOLOGY

UM. CF

Disponibilità bassa

Generalmente disp. in 20 gg.

Qt.Min.Ord. 2

Contattaci:

02 4073747

Download PDF

Codici aggiuntivi

€ 98,00

IVA esclusa

Salva nei preferiti

Invia link

https://www.cepeitalia.it/wec/circuit-technology-wire-dots-squares-100mm-210-pk/f5f6e898494ebcfc3f55e5fba5cdda04/scheda_articolo/?forcelang=it

ALLEGATI

Documentazione Tecnica

Safety Data Sheet A12728

Safety Data Sheet A12736

SCHEDA PRODOTTO

Circuit Technology Wire Dots Squares 10.0mm 210/pk

Hold wires in place permanently!
Pre-cut shapes of thin, flexible polymer film membrane. Permanent, pressure-sensitive adhesive results in a strong bond. Available in round, square shapes and two sizes.

Material Properties:

Cover Film	Clear Polyester Film 1.0 mil (.025 mm) Thick
Adhesive	High performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP)
Relative High Temperature Operating Ranges	Short term (minutes/hours) 400°F (204°C) Long term (days/weeks) 300°F (149°C)
Application	Specifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic markets.
Shelf Life	Minimum 12 months.

Physical and Thermal Properties:

Property	Typical Value	Unit	Test Method
Peel Strength 72 hrs @ 22 C	84	0z./in.	ASTM D3330 Modified
Static Shear Strength 72 F (22 C) / 1000g	>10,000	min	ASTM D3654
Tensile Strength (Yield) 72 F (22 C)	>2600	psi	ASTM D2370
Elongation	100	%	ASTM D2370
Thermal Conductivity	0.17	w/m-k	ASTM C518
Coefficient of Thermal Expansion	5.5 x 10 ^-4	m/m/C	ASTM D696 25-175C

Electrical Properties:

Property	Typical Value	Unit	Test Method
Dielectric Strength	1700	volts/mil	ASTM D149
Dielectric Constant 25 C, 1 kHz	3.4	------	ASTM D150
Dissipation Factor 25 C, 1 kHz	0.018	------	ASTM D150
Surface Resistivity - Adhesive Layer	>1 x 10 ¹⁴	ohm/square	ASTM D257
Surface Resistivity - Polymer Film Layer	>1 x 10 ¹⁶	ohm/square	ASTM D257
Volume Resistivity - Adhesive Layer	>1 x 10 ¹⁵	ohm/cm	ASTM D257
Volume Resistivity - Polymer Film Layer	>1 x 10 ¹⁸	ohm/cm	ASTM D257
Insulation/Moisture Resistance - Adhesive Layer	>1 x 10 ¹¹	ohm	MIL-I-46058C (100 VDC 60 sec)
Insulation/Moisture Resistance - Polymer Film Layer	>1 x 10 ¹²	ohm	MIL-I-46058C (100 VDC 60 sec)
Voltage Breakdown	3500	volts	------