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Power Requirements
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120 VAC, 50/60 Hz (1550 Watts maximum) || 230 VAC, 50 Hz (1550 Watts maximum)
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Dimensions
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737mm (29") H x 686mm (27") W x 737mm (29") D
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Weight (Without Computer)
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45kg (100lbs)
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Top-side Heater
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Medium/Long wave IR, 500 Watts
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Bottom-side Preheater
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Medium/Long wave IR, 1000 Watts; 220mm (8.6”) x 155mm (6.1”)
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Bottom-side Preheater Working Height
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Adjustable working height from lowest position up to 38mm (1.5”) closer to the PCB
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High Sensitivity Vacuum Pick
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Pick is counterweight balanced, and utilizes an optical sensor and precision high temperature linear ball bearings, ensuring delicate placement and pick up of parts from PCB. Includes six (6) Vacuum Picks
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Precision Placement Capability
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Advanced professional placement system utilizing a stepper motor and position encoding provides smooth, precise movement, with no drift, allowing for repeatable and accurate placement.
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Placement Accuracy
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Stepper motor with precision positioning of to 28μm (.0011”) accuracy
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Board Support Capability
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Integrated Board Support Wand prevents PCBs from sagging/warping during rework and is adjustable to clear parts on bottom of PCB
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Maximum Target Temperature
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Each profile zone has a maximum target temperature of 328 °C (624 °F)
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Precision PCB Holder
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Advanced table features micrometer X & Y adjustment, extruded board holder arms, spring loaded, with T-slots and movable clamps for both large and irregularly shaped boards with non-uniform edges
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Maximum/Minimum PCB Size Maximum
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305mm x 305mm (12” x 12”); Minimum: N/A arms close down completely.
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Maximum/Minimum Component Size Maximum
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65mm (2.5”) x 65mm (2.5”); Minimum: 1mm Sq.
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IR Pyrometer and Thermocouple Inputs
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A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples)
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High Definition Optical Alignment System
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Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom capability and Stable Zoom.
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Motorized Optics Housing (Sodr-Cam
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Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use.
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Quad-Field Imaging
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For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification
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Single Axis Operation
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All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow.
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Auxiliary Cooling Fan
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Standard, for secondary cooling of the PCB
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Component Nests
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Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Optional component holding system for parts under 5mm Sq.
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Flux Dip Plate
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Included; allows for automated flux dipping
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Stencils/Solder Paste
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Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process
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