CIRCUIT TECHNOLOGY
CIRCUIT TECHNOLOGY WIRE DOTS (10.0 MM) ROUND
CIRCUIT TECHNOLOGY - WIRE DOTS ROUND CONSISTING OF A THIN, FLEXIBLE POLYMER FILM 1.0 MIL (.025 MM) COATED ON ONE. 210/PKG. RIPARAZIONE CIRCUITI.
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CIRCUIT TECHNOLOGY
CIRCUIT TECHNOLOGY - WIRE DOTS ROUND CONSISTING OF A THIN, FLEXIBLE POLYMER FILM 1.0 MIL (.025 MM) COATED ON ONE. 210/PKG. RIPARAZIONE CIRCUITI.
Quantità a stock: 0
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Clean up your act when bonding wires. Wire Dots make the job of bonding jumper wires neat and fast.
Wire Dots are a wire tacking system consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. The result is a highly conformable, high strength bond.
Wire Dots will hold secure after exposure to numerous chemicals including cleaning solutions/sprays, saponifiers, mild acids and alkalies.
Wire Dots will hold secure through a typical circuit board hot water wash.
Material Properties:
| Cover Film | Clear Polyester Film 1.0 mil (.025 mm) Thick |
| Adhesive | High performance Acrylic Adhesive 5.2 mils (0.13 mm) Thick (3M #3468MP) |
| Relative High Temperature Operating Ranges | Short term (minutes/hours) 400°F (204°C) Long term (days/weeks) 300°F (149°C) |
| Application | Specifically designed for long term bonding to printed circuit boards and high surface energy plastics for the aerospace, medical and industrial equipment, automotive, appliance and electronic markets. |
| Shelf Life | Minimum 12 months. |
Physical and Thermal Properties:
| Property | Typical Value | Unit | Test Method |
| Peel Strength 72 hrs @ 22 C | 84 | 0z./in. | ASTM D3330 Modified |
| Static Shear Strength 72 F (22 C) / 1000g | >10,000 | min | ASTM D3654 |
| Tensile Strength (Yield) 72 F (22 C) | >2600 | psi | ASTM D2370 |
| Elongation | 100 | % | ASTM D2370 |
| Thermal Conductivity | 0.17 | w/m-k | ASTM C518 |
| Coefficient of Thermal Expansion | 5.5 x 10 -4 | m/m/C | ASTM D696 25-175C |
Electrical Properties:
| Property | Typical Value | Unit | Test Method |
| Dielectric Strength | 1700 | volts/mil | ASTM D149 |
| Dielectric Constant 25 C, 1 kHz | 3.4 | ------ | ASTM D150 |
| Dissipation Factor 25 C, 1 kHz | 0.018 | ------ | ASTM D150 |
| Surface Resistivity - Adhesive Layer | >1 x 10 14 | ohm/square | ASTM D257 |
| Surface Resistivity - Polymer Film Layer | >1 x 10 16 | ohm/square | ASTM D257 |
| Volume Resistivity - Adhesive Layer | >1 x 10 15 | ohm/cm | ASTM D257 |
| Volume Resistivity - Polymer Film Layer | >1 x 10 18 | ohm/cm | ASTM D257 |
| Insulation/Moisture Resistance - Adhesive Layer | >1 x 10 11 | ohm | MIL-I-46058C (100 VDC 60 sec) |
| Insulation/Moisture Resistance - Polymer Film Layer | >1 x 10 12 | ohm | MIL-I-46058C (100 VDC 60 sec) |
| Voltage Breakdown | 3500 | volts | ------ |