DOW CORNING
DOW CORNING DA 6534 SIRINGA 35G
DOW CORNING DA-6534 SIRINGA 35G
Quantità a stock: 0

DOW CORNING
DOW CORNING DA-6534 SIRINGA 35G
Quantità a stock: 0
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Uses:
DOWSIL™ DA-6534 Adhesive is suitable for microelectronics thermal interface applications
Benefits:
Low ionic impurities
Very high thermal conductivity
Contains silver filler
Good adhesion to Ni, Al, laminate, and silicon
Microelectronics grade material
Increases reliability by removing heat
Enables electrically conductive performance
Good adhesive performance for TIM1 or lid seal applications
Typical Properties
Color: Gray, Gray
Durometer - Shore A: 91, 91
Heat Cure: 120 Minutes @ 150 Deg C, 120 Minutes @ 150 Deg C
Thermal Conductivity:6.8 W/m・K, 6.8 W/m・K
Volume Resistivity: 0.00018 Ω・cm, 0.00018 Ω・cm
Application Benefits
Primerless Adhesion: Yes, Yes
Use: Boards and Assemblies, Components
Processing-Formulating Benefits
Number of Parts: One Part, One Part