B43423

DOW CORNING

DOW CORNING DA 6534 SIRINGA 35G

DOW CORNING DA-6534 SIRINGA 35G

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Documenti del prodotto B43423

B43423

Approfondimento

DOW CORNING DA 6534 siringa 35g

Uses:
DOWSIL™ DA-6534 Adhesive is suitable for microelectronics thermal interface applications
Benefits:
Low ionic impurities
Very high thermal conductivity
Contains silver filler
Good adhesion to Ni, Al, laminate, and silicon
Microelectronics grade material
Increases reliability by removing heat
Enables electrically conductive performance
Good adhesive performance for TIM1 or lid seal applications

 

Typical Properties
Color: Gray, Gray
Durometer - Shore A: 91, 91
Heat Cure: 120 Minutes @ 150 Deg C, 120 Minutes @ 150 Deg C
Thermal Conductivity:6.8 W/m・K, 6.8 W/m・K
Volume Resistivity: 0.00018 Ω・cm, 0.00018 Ω・cm


Application Benefits
Primerless Adhesion: Yes, Yes
Use: Boards and Assemblies, Components


Processing-Formulating Benefits
Number of Parts: One Part, One Part