CIRCUIT TECHNOLOGY CIRCUIT FRAME, VARIOUS LAND

Name: CIRCUIT TECHNOLOGY CIRCUIT FRAME, VARIOUS LAND
Brand: CIRCUIT TECHNOLOGY
SKU: B44744

CIRCUIT TECHNOLOGY CIRCUIT FRAME SHAPES, PATTERNS INCLUDED:A PTH LANDS 0.050" OD X 0.030" ID (1.27 MM OD X 0.76 MM ID)B PTH LANDS 0.060" OD X 0.040" ID (1.52 MM OD X 1.00 MM ID)C PTH LANDS 0.070" OD X 0.040" ID (1.78 MM OD X 1.00 MM ID)D PTH LAN

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B44744

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Circuit Technology Circuit Frame, Various Land Sizes

Circuit Frame with dry-film adhesive backing that makes replacing damaged circuits easy, fast and highly reliable.

-	Qty	Shapes, Patterns Included
A	6	PTH Lands 0.050" OD x 0.030" ID (1.27 mm OD x 0.76 mm ID)
B	6	PTH Lands 0.060" OD x 0.040" ID (1.52 mm OD x 1.00 mm ID)
C	6	PTH Lands 0.070" OD x 0.040" ID (1.78 mm OD x 1.00 mm ID)
D	6	PTH Lands 0.080" OD x 0.050" ID (1.27 mm OD x 1.27 mm ID)
E	6	PTH Lands 0.090" OD x 0.055" ID (1.52 mm OD x 1.40 mm ID)
F	6	PTH Lands 0.100" OD x 0.060" ID (1.78 mm OD x 1.52 mm ID)

Specifications:

Overall Frame Size	2.25" x 1.50" (57 x 38 mm)
Base Material	Rolled annealed copper foil .0014" (.036 mm) thick.
Plating	.0001" (.0025 mm) Bright Tin (Lead Free), RoHS Compliant
Surface Treatments	Top side plated. Bottom side treated to promote adhesion.
Shelf Life	Shelf life of base material without adhesive application is unlimited.
RoHS and REACH	CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high concern in Article 59 of REACH.

Adhesive Backing	Optional adhesive backing film is applied using a quick-bond process that retains B-staged adhesive properties.
Adhesive Material	B-staged modified acrylic film adhesive .002" (.051 mm) thick.
Certification	Adhesive backing is certified to IPC-4203/18: Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films.
Solder Resistance	Passes IPC-TM-650, 2.4.13 Solder Float Resistance 10 seconds at 288°C (550°F).
Bonding Temperature	475°F ± 25°F (246°C ± 14°C)
Bonding Pressure	200 - 400 psi (14-28 kg/cm2)
Bonding Time	30 seconds
Peel Strength	Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Outgassing	The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications. Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are; Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%
Shelf Life	One year minimum. Each Circuit Frame package is stamped with the expiration date. Adhesive material is sensitive to light and heat. Store in a dark or refrigerated environment to preserve the shelf life.